GLAS-PPE/2008-25

Radiation Hardness Tests of Double-Sided 3D Detectors

D. Pennicard(1), C. Fleta(1), G. Pellegrini(2), M. Lozano(2), R. Bates(1), C. Parkes(1), L. Eklund(1), T. Szumlak(1)

(1) University of Glasgow, Kelvin Building, Glasgow G12 8QQ, Scotland.
(2) Instituto de Microelectronica de Barcelona, IMB-CNM-CSIC, 08193 Bellaterra, Barcelona, Spain

3D detectors are potentially useful for future high-luminosity colliders such as the SLHC, due to their radiation hardness. IMB-CNM have fabricated a set of 3D detectors that use a "double sided" 3D structure, where the two sets of electrode columns are etched from opposite sides of the substrate, and do not pass through the full substrate thickness. Simulations show that this structure should give similar radiation hardness to the standard full-3D structure. Two sets of devices have been successfully tested; Medipix2 pixel detectors and strip detectors coupled to LHC-speed readout electronics. The unirradiated 3D Medipix2 detectors have shown extremely low operating voltages and low charge sharing in tests with X-rays, and the strips have shown relatively high charge collection at high levels of radiation damage.

2008 IEEE Nuclear Science Symposium and Medical Imaging Conference
18-25 October 2008, Dresden, Germany

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